|
制程能力及檢測參數 Process?capability?and?checking?parameters |
||||||||
| ITEM | Technical capabilities | |||||||
|
層次 Layers |
2-32layers | |||||||
|
最大尺寸 Max.Board Size |
1200mm*610mm | |||||||
| 79"*24" | ||||||||
|
板厚 Finished Board Thickness |
0.25mm--10.0mm | |||||||
| 0.01"--0.4" | ||||||||
|
銅厚 Finished?Copper?Thickness |
17um-420um | |||||||
| 0.5OZ--12OZ | ||||||||
|
最小線寬/線距 Min.Trace Width/Space |
0.075mm/0.065mm | |||||||
| 0.003"/0.0026" | ||||||||
|
最小孔徑 Min.Hole Size |
0.1mm | |||||||
| 0.006" | ||||||||
|
PTH孔孔徑差 Hole Dim. Tolerance(PTH) |
±0.05mm | |||||||
| ±0.002" | ||||||||
|
NPTH孔孔徑差 Hole Dim.Tolerance(NPTH) |
±0.05mm | |||||||
| ±0.002" | ||||||||
|
孔位公差 Drill Location Tolerance |
±0.05mm | |||||||
| ±0.002" | ||||||||
|
V-CUT角度 V-Score Degrees |
20-90度 | |||||||
| / | ||||||||
|
最小V-CUT板厚 Min.V-Score PCB Thickness |
0.25mm | |||||||
| 0.01" | ||||||||
|
外型公差 CNC Routing Tolerance |
±0.1mm | |||||||
| ±0.004" | ||||||||
|
最小盲/埋孔 Min.Blind/Buried Via |
0.1mm | |||||||
| 0.0039" | ||||||||
|
塞孔 Plug Hole Size |
0.2mm--0.5mm | |||||||
| 0.008"--0.02" | ||||||||
|
最小BGA Min.BGA PAD |
0.2mm | |||||||
| 0.008" | ||||||||
|
材質 Materials |
FR4板（指定品牌物料：如建滔、生益、聯茂、南亞、臺光臺耀等)、高頻板、鐵氟龍板、陶瓷板、羅杰斯板等等 |
|||||||
|
FR4 (designated brand materials: such as KB, Shengyi, ITEQ, NANYA, EMC,CENS and so on), high frequency board, Teflon board, ceramic board, Rogers board and so on |
||||||||
|
表面處理 Surface Finish |
無鉛噴錫，沉金，沉銀，沉錫，OSP,電厚金，沉金+OSP,噴錫+金手指，鎳鈀金， |
|||||||
|
LF-HASL,ENIG,ImAg,ImSn,OSP,Gold plating,ENIG+OSP,HASL+G/F， |
||||||||
|
翹曲度 Warp&Twist |
≤0.75% | |||||||
|
通斷測試 Electrical Testing |
50--300V | |||||||
|
可焊性試驗 Solderability Testing |
245±5℃,3sec Wetting area least95% | |||||||
|
熱沖擊試驗 Thermal Cycling Testing |
288±5℃,10sec,3cycles | |||||||
|
離子污染測試 Ionic Contamination Testing |
Pb,Hg,Cd,Cr(VI),PBB,PBDE六項均小等于1000ppm |
|||||||
|
Pb,Hg,Cd,Cr(VI),PBB,PBDE?six items are less than 1000ppm |
||||||||
|
附著力測試 Soldmask Adhesion?Testing |
260℃+/-5,10S，3times | |||||||
|
特殊工藝 Special Technology |
半孔、高Tg板、混壓板、無鹵素板、超薄超厚板、邦定、 阻抗、藍膠、碳油、電厚金、鎳鈀金、金手指、盲鑼、埋盲孔、沉頭孔、樹脂塞孔等. |
|||||||
